www.statschippac.com features ? body sizes: 7 x 7mm to 14 x 14mm package height: 1.0mm lead counts: 32l to 128l lead pitch: 0.80mm to 0.40mm wide range of open tool leadframe and die pad sizes available jedec standard compliant lead-free and green material sets available applications asic dsp gate array logic/microprocessors/controllers multimedia, pc chipsets ? 7 x 7mm to 14 x 14mm 32 to 128 lead count lead pitch range from 0.80mm to 0.40mm description the thin profile quad flat pack (TQFP) belongs to stats chippac?s qfp family. at 1.0mm body thickness, the TQFP is the thinnest package in the qfp family. this thin package is made possible by a well controlled low loop wire bonding process and package warpage control during the molding process. TQFP is suitable for mainstream cost sensitive applications where thickness and weight are premium. TQFP thin profile quad flat pack
the stats chippac logo is a registered trademark of stats chippac ltd. all other product names and other company names herein a re for identification purposes only and may be the trademarks or registered trademarks of their respective owners. stats chippac disclaims any and all rights in those marks. stats chippac makes no guarantee or warr anty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. under no circumstances shall stats chippac be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. stats chippac reserves the right to change the information at any time and without notice. ?copyright 2005. stats chippac ltd. all rights reserved. january 2005 corporate office 10 ang mo kio st. 65, #05-17/20 techpoint, singapore 569059 tel: 65-6824-7777 fax: 65-6720-7823 global offices usa 510-979-8000 japan 81-43-351-3320 china 86-21- 5976-5858 m alaysia 603-4257-6222 korea 82-31-639-8911 taiwan 886-3-593-6565 uk 44-1483-413-700 netherlands 3 1-38-333-2023 TQFP thin profile quad flat pack package configurations package size (mm) lead count 7 x 7 32, 48 10 x 10 44, 52, 64 12 x 12 80, 100 14 x 14 100, 128 specifications die thickness 230-280 m (9-11mils) range preferred gold wire 25/30 m (1.0/1.2mils) diameter, 99.999%au lead finish 85/15 sn/pb or matte tin marking laser/ink packing options jedec tray/tape and reel reliability moisture sensitivity level jedec level 3 temperature cycling -65c/150c, 1000 cycles high temperature storage 150c, 500 hrs pressure cooker test 121c 100% rh, 2 atm, 168 hrs liquid thermal shock (opt) -55c/125c, 1000 cycles thermal performance, ja (c/w) package body size (mm) pad size (mm) die size (mm) thermal performance, ja (c/w) 48l 7 x 7 x 1.0 5.3 x 5.3 3.8 x 3.8 53.4 100l 14 x 14 x 1.0 9.0 x 9.0 7.8 x 7.8 38.6 note: simulation data for package mounted on 4 layer pcb (per jedec jesd51-7) under natural convection as defined in jesd51-2. cross-section electrical performance electrical parasitic data is highly dependent on the package layout. 3d electrical simulation can be used on the specific packa ge design to provide the best prediction of electrical behavior. data below is for a frequency of 100mhz and assumes 1.0 mil gold bonding wire. conductor length resistance inductance inductance capacitance capacitance component (mm) (mohms) (nh) mutual (nh) (pf) mutual (pf) wire 2 120 1.65 0.45 - 0.85 0.10 0.01 - 0.02 lead (7 x 7mm, 32l) 1.4 - 2.2 11.0 - 18.0 0.64 - 0.99 0.31 - 0.49 0.21 - 0.33 0.07 - 0.12 total (7 x 7mm, 32l) 131 - 138 2.29 - 2.64 0.76 - 1.34 0.31 - 0.43 0.08 - 0.14 wire 2 120 1.65 0.45 - 0.85 0.10 0.01 - 0.02 lead (14 x 14mm, 128l) 3.0 - 4.5 24.0 - 36.0 1.96 - 2.92 1.08 - 1.61 0.45 - 0.67 0.20 - 0.30 total (14 x 14mm, 128l) 144.0 - 156.0 3.61 - 4.57 1.53 - 2.46 0.55 - 0.77 0.21 - 0.32
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